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FCBGA – Flip-Chip BGA is a special microelectronic chip package

FCBGA - Flip-Chip-BGA-is-a-special-microelectronic-chip-package

Flip-Chip BGA or FCBGA have become very popular in recent times. In fact, not only researchers but different businesses have also begun to explore its applications. Let’s discuss everything about FCBGA.

What does FCBGA mean?

Actually, a FCBGA is a high-performance but affordable semiconductor packaging. It uses the technology of C4 or controlled collapse chip connection. This technology is also recognized as a flip chip. Flip-chip technology is used to substrate interconnection.

Now, it is worth noting that FCBGA offers better functionality and signal density in smaller packaging and die footprints. When performance is preferred over cost, FCBGA is often considered and used. In addition, it is possible to mount FCBGA packages with the use of standard PCBs or printed circuit boards. Not to mention, standard repair practices can be used for replacing it.

In modern times, most packages of FCBGA are assembled or mounted on multi-layered or even two-metal layer organic laminate or ceramic substrates. Depending on the supplier, these packages may be offered in the full lid, flat lid, and even in bare die configurations.

FCBGA typically works through the solder bumps that are present on the surface of chip pads. Meanwhile, the process itself begins with integrated circuits on the top of the wafer. After that, pads are intricately metalized. Once they have been metalized, the placement of solder balls is performed on each pad. Afterward, the chips are cut before they are flipped to make sure that the position of the solder balls can face the external circuitry. Then, the solder is reflowed, which helps in creating an interconnection.

What is the FCBGA substrate?

When we talk about FCBGA substrates, they are primarily high-value PCBs that interlink or connect the main substrate to the semiconductor chips. In order to create autonomous vehicles, they are definitely one of the main components.

Why use FCBGA?

There are generally several reasons why FCBGA should be used. Flip chips are quite useful and effective in different high-frequency applications. It is primarily because the chip is not only small but is also placed on the circuit board. Therefore, signal speeds are higher and inductance is small. Not to mention, they have higher thermal conductivity and moisture resistance.
Compared to standard packages that involve wire bonding, FCBGAs are often considered better. It is in semiconductor operations that flip chips are commonly used. It should be noted that some other components such as passive filters and detector arrays can also utilize the design of a flip chip. Still, even though FCBGA remains affordable while offering high performance, there are not suited for all circumstances. For example, you require a flat mounting surface if you want to use it.

At the same time, you must also consider thermal expansion because the flip chip often creates connections that are particularly sensitive to breaking and are rigid. In case you can overlook these issues, FCBGA is definitely a great choice to consider.

Where the FCBGA is used?

FCBGAs undoubtedly have different applications. For example, they are widely used in different high-performance applications such as DSF and ASIC. In addition to it, these packages are utilized mainly in different semiconductor manufacturers like in Freescale processors, custom ASICs, and Intel’s Cores among others.

What’s the feature of FCBGA?

What's-the-feature-of-FCBGASome of the main features of FCBGA include:
● High thermal and electrical performance due to the technology of flip-chip bonding.
● Has wide support from different high-end applications to many consumer appliances.
● Offers compatibility with ultra multi-pin through the arrangement of the chip electrode.
● Can be customized fully according to the requirements of the user.
● Offers high-speed transmission and is capable of decreasing the distortion of waveforms.
● Ensures a better dissipation of heat that is caused primarily by the high electricity consumption. It is performed using a heat spreader.

What is the packaging process of FCBGA?

The packaging process begins with the preparation or development of wafer bumps. It is followed by water cutting and chip flow. After that, underfill thermal grease is performed and then sealing solder distribution is carried out.

Eventually, capping is performed and then assembly of solder balls is performed. After reflow soldering, marketing and separation are carried out. In the end, a final inspection and testing are performed before FCBGA is packaged.



What is a flip chip?

Actually, a flip chip is also recognized as a C4 or controlled collapse chip connection. Fundamentally, it is the technique that involves interconnecting dies like integrated passive devices, IC chips, and semiconductor devices among others to external circuitry that is present on chip pads. This technique is completely different from wire bonding which involves the upright mounting of the chip.

What is the difference between a flip chip and BGA?

Even though a FCBGA is often confused with BGA, they are both different from each other. The primary difference between a FCBGA and a normal BGA is the use of a flip chip die and it is internal to the whole package.

How many types of BGA are there?

There are several types of BGA and they include Micro BGA, Metal BGA, Flip Chip BGA, Enhanced BGA, Tape BGA, Ceramic BGA, and Plastic BGA. It is important to note that all of these BGAs are different from each other and their characteristics and features also differ from each other. Therefore, before they are to be used, it is necessary to identify and comprehend their applications and suitability.


Overall, it can be said that FCBGA has become very popular among not only researchers but also businesses. Their applications are extensive and range from different high-performance applications and processes to even consumer appliances. A FCBGA is generally a BGA that uses the technology of controlled collapse chip connection. It is different from the conventional BGA in the sense that it offers better thermal and electrical performance. However, it often results in connections that are brittle. Therefore, it is better to determine if it is suitable for the required application or not before it is to be used.



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