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IC carrier boards lead PCB industry growth

IC carrier boards lead PCB industry growth
IC产业链封测环节的关键载体 IC industry chain can be roughly divided into three links: chip design, wafer manufacturing and sealing and testing. Packaging substrate,similar to the PCB substrate, as a key carrier of the IC industry chain plays an important role, accounting for 40-50% of the cost of packaging raw materials, its downstream for the semiconductor packaging industry, such as Taiwan Risheng, Lixing technology, China Tongfu Microelectronics is also an excellent semiconductor PCBA enterprises. The package substrate not only provides support, heat dissipation and protection for the chip, but also provides electronic connection between the chip and PCB, and can even be embedded in passive or active devices to achieve certain system functions. Packaging substrate and chip are highly correlated, and different chips often need to design special packaging substrate to match. IC carrier board technologies are classified according to the connection mode between IC and loadboard or the connection mode between loadboard and PCB. The connection between the IC and the carrier board is composed of Flip Chip (FC) and Wire Bounded (WB). The connection between board and PCB can be divided into BGA (Ball Grid Array Package) and CSP (Chip Scale Package). IC carrier board clarification and application Therefore, IC loadboard can be divided into four categories: WB-BGA, WBCSP, FCBGA and FC-CSP. According to different applications, the packaging substrate can be divided into memory chip packaging substrate, MEMS packaging substrate, RF module packaging substrate, processor chip packaging substrate and high-speed communication packaging substrate。

IC carrier board to lead the PCB industry output value growth

Prismark data show that the global PCB output value is $80.45 billion, increased 23.4% year on year, among which IC board output value is $14.16 billion,  up 39% year on year, the growth rate ranks the first, multilayer board second, up 25.4% year on year. Looking ahead, Prismark predicts that the PCB industry 2021-2026 CAGR of 4.8%, to 2025 the global PCB industry output value will reach $ 101.56 billion, including IC carrier board output value of $ 21.43 billion, 20 years to 25 years growth rate of 8.6%, leading the industry growth. IC carrier board competition pattern is concentrated, Chinese manufacturers account for a low proportion, China’s replacement space is large.According to NTI statistics, from the manufacturer’s point of view, in 2021 the global packaging substrate CR10  accounting for 82.5%, CR3 accounting for  39%, the top three manufacturers are China Taiwan Unimicron, Japan Ibiden, South Korea SEMCO, respectively, the market share of 15%, 14%, 11%. /global packaging substrate ranking From the point of view of origin, the basic production of packaging in Taiwan, Japan, South Korea, respectively, 31%, 20%, 28%, China’s output value of 16%.  However, China’s output value includes the output value of foreign and Chinese production of packaging substrates in China, foreign-funded enterprises in the country, such as Taiwan’s Nanya PCB/ Suzhou Xinxing / Suzhou King Shuo, Hong Kong Mei Long Xiang / Anjeli Electronics, Austria Otus, and the  IC carrier board manufacturers are mainly Fastprint Technology, SCC, Zhuhai Substrates, Danbang Technology, Dongguan Hong Yuen Electronics, and Proware Electronics (a company in which Suntak Technology has a stake), the output value of packaging substrates from Chinese enterprises is about $540 million, accounting for 5.3% of the global share.

Chinese semiconductor production expansion expected to drive the localization of IC carrier board

/Chinese semiconductor production expansion-expected to drive the localization of IC carrier board Chinese IDM and fab production capacity has been put into operation one after another to drive Chinese packaging and testing demand to further improve, which is expected to drive the localization of upstream IC carrier board. Under the influence of multiple factors of policy , market and  international environment, the process of Chinese semiconductor substitution continues to advance and the semiconductor industry expands rapidly. According to the data released by China Semiconductor Association (CSIA), the domestic IC market size in 2021 is 1,045.83 billion RMB, up 18.2% year-on-year, with a CAGR of 18% from 2017-2021. Among them, the market size of IC packaging and testing industry is 276.3 billion yuan, up 10.1% year-on-year, with a CAGR of 7.4% from 2017-2021. In the future, with the gradual release of Chinese IDM and foundry capacity, the demand for China’s packaging and testing will be boosted. IC carrier board is an important raw material for PCBA packaging and PCBA testing , and it is expected that with the gradual release of Chinese manufacturing and packaging capacity, the demand for China’s IC carrier board will be substantially increased. From the point of view of origin, the basic production of packaging in Taiwan, Japan, South Korea, respectively, 31%, 20%, 28%, China’s output value of 16%, however, China’s output value includes the foreign and domestic production of packaging substrates in China, foreign-funded enterprises in the country, such as Taiwan’s Nanya PCB/ Suzhou Xinxing / Suzhou King Shuo, Hong Kong Mei Long Xiang / Anjeli Electronics, Austria Otus, and the United States. Chinese IC carrier board manufacturers are mainly Fastprint Technology, SCC, Zhuhai Substrates, Danbang Technology, Dongguan Hong Yuen Electronics, and Proware Electronics (a company in which Suntak Technology has a stake), the output value of packaging substrates from domestic enterprises is about $540 million, accounting for 5.3% of the global share.
 

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