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PCB Industry Project Inventory July 2022



On July 6, LG Innotek announced at the Gumi City Hall in South Korea that it has signed an agreement with Gyeongsangbuk-do and Gumi City to make a large-scale investment of 1.4 trillion won in its Gumi plant in Gyeongsangbuk-do, South Korea. The company plans to establish a manufacturing facility to produce globally competitive semiconductor substrates (FC-BGA) and and camera modules.

Through the agreement, LG Innotek will invest 1.4 trillion won in the Gumi plant by 2023, including the Gumi A3 plant (with a total floor area of about 230,000㎡) of LG Electronics, which it acquired last month for 283.4 billion won. The company’s Gumi factory covers a total area of approximately 370,000㎡, equivalent to the size of 52 soccer fields.

On July 26, in order to fully grasp the market opportunities and based on the development needs, Hon-Flex Electronics intends to sign the “Investment Cooperation Agreement” with the People’s Government of Gaoping District, Nanchong City, Sichuan Province in southwest China , to build an electronic information industry cluster and a future technology industry city in Gaoping District, Nanchong City, by relying on Xinlenses and through self-built projects or assisting the government to introduce leading enterprises and supporting projects in the industry chain.

The project is to be built in three phases, of which the first phase will invest 1 billion RMB and cover an area of 100 acres to build a high-end electronic intelligent manufacturing model factory, which will focus on the demand for FPC+ product modules for new energy and vehicle intelligence, in addition to carrying the original FPC+ strategy in the fields of pressure sensing consumer electronics, 5G communication-related modules, display-related modules and virtual mining machines. 


At the same time, Xinlenses intends to sign the “Contribution Agreement” with Nanchong Linjiang International Port Development Co. Subsequent to the proposed investment of 1.2 billion in the second phase and 8 billion in the third phase, the second and third phase project matters have not been specifically agreed.

On July 27, Kuangshun Materials announced that it intends to raise total funds of up to RMB 570 million for an annual production capacity of 50,000 tons of electronic photographic materials and supporting materials project to be implemented in Longnan City, Jiangxi Province by Jiangxi Guangzhen Photographic Materials Co. In addition to optimizing the original ink and coating business, the company will further expand the production and sales of photoresist for flat panel display, photoresist for integrated circuit and supporting materials through this project to build a new business growth point.

July 29, JOVE Circuit announced that, according to the company’s business scale development needs, the company intends to invest in Thailand to establish a subsidiary, the proposed investment amount of up to 75 million U.S. dollars (subject to the final actual investment amount). JOVEPCB ENTERPRISE LIMITED, a wholly-owned subsidiary of the company, holds 100% of the shares and is mainly engaged in the design, production and sales services of PCB and electronic products.

On July 30, Copper Crown Copper Foil released two consecutive announcements that the company intends to use part of the over-raising funds of 600 million RMB to invest in the construction of 10,000 tons per year ultra-thin electronic copper foil project for high-precision energy storage. 


At the same time, the company intends to use part of the excess funds of 964 million RMB to invest in the construction of 15,000 tons per year of high-precision energy storage with ultra-thin electronic copper foil project.

The announcement shows that the main body of the 10,000 tons per year high-precision ultra-thin electronic copper foil for energy storage project is Tongling Nonferrous Copper Crown Copper Foil Co. The total investment amount of the project is 932 million RMB, including construction investment of 771 million RMB, the company intends to use part of the over-raising funds 600 million RMB, the shortfall will be resolved through self-financing. 

The project is the first phase of 10,000 tons per year of the 20,000 tons per year electronic copper foil project. 15,000 tons per year of ultra-thin electronic copper foil project for high-precision energy storage is implemented by Anhui Copper Crown Copper Foil Group Co. The shortage of funds will be solved by self-financing.


On July 22, Qunqi Technology’s high-end IC substrate project was signed in Kunshan High-tech Zone, Jiangsu Province. The project will be invested by Kunshan Qunqi Technology Co., Ltd. with a total investment of USD490 million, planning to build a production base and R&D center of 75,000 square meters, mainly producing high-end and market shortage of IC packaging substrates required, and applied to electronic information, automotive, artificial intelligence and other fields.

On July 23, Xiaogan City, Hubei Province held a centralized signing ceremony for investment projects in the second quarter of 2022. 28 projects were signed at the event, with a total investment of 27.23 billion RMB. Among the signed projects, including the expansion project signed by Hubei Jinlu Technology Co.
Ltd. is a wholly-owned subsidiary of Jinlu Electronic Technology Co., Ltd. established in 2017, with business scope including research and development, production and sales of high-density interconnected laminates, multilayer flexible boards, rigid-flex PCBs and cover loading boards.

Start of construction

On July 2, Terbium Lo intelligent robot project started and the second quarter project focused on the completion of the whole district was held in Yandu District, Yancheng City, Jiangsu Province. The opening and completion of a total of 30 projects, including 15 start-up projects, with a total investment of 15 billion RMB. The project of DSBJ IC carrier board was started centrally.

The project is invested by Suzhou DSBJ Manufacturing Co., Ltd. with a total investment of 5 billion RMB, of which 1.5 billion RMB is invested in the first phase and 800 million RMB is invested in equipment, the project will start construction in July 2022 and is expected to be completed and put into operation in March 2023, after the completion of the first phase project, the annual output of carrier board can be 100,000 square meters.

On July 15, Dalian Jixing Electronics Co., Ltd. high-frequency flexible circuit board R & D production base project in Dalian City, Liaoning Province, Puwan Economic Zone laid the foundation stone. The project has a total investment of 200 million RMB, covers an area of about 20,000 square meters, mainly for the development and production of 5G, high frequency, high precision flexible circuit boards, with an annual capacity of 150,000 square meters, and is scheduled to be completed and put into operation in July 2023.

After the completion of the base, it will work with domestic material suppliers to jointly develop new materials and new products related to high frequency, breaking the status quo of foreign monopoly on high frequency materials, and plans to establish a high frequency flexible circuit board R&D center in the northeast region, forming a regional industrial alliance to add momentum to the innovative development of the Chinese high frequency industry.

Completed and put into operation

On July 3, Zhejiang Province, Huzhou City, Deqing County, the second quarter of the major projects focused on the completion of activities and Zhejiang Qi Ants Industrial project groundbreaking ceremony was held. A total of 12 projects were completed, including 7 completed projects, including an annual output of 250,000 square meters of high-density multilayer PCB project.

The project is invested by Huzhou Nautical Jun Electronics Co., Ltd. with a total investment of 195 million RMB, located in the Economic Development Zone (New City Park) of Xincheng Town, Deqing County, Zhejiang Province, with 18 mu of new industrial land, 30,000 square meters of new construction area, new CNC drilling machine, automatic exposure machine, CNC milling machine, gold production line, lead-free tin spraying production line and other equipment, the project will form an annual output of 250,000 square meters of high-density multilayer PCB production capacity of the project.


On July 12, the commissioning ceremony of Huaxin Copper Foil Phase IV 8000 tons per year HVLP (5G) copper foil project was held in the factory, HVLP copper foil is the core material of 5G base station and high frequency and high speed communication equipment, which plays a vital role in the development of 5G communication.

With a total investment of RMB 680 million, the project introduces advanced production equipment from Korea and Japan and is equipped with first-class inspection and analysis instruments. Through the company’s unremitting efforts, it has broken through the necking technology and achieved mass production of copper foil for 5G, filling the gap in China. The project started construction in February 2021 and lasted for 18 months.



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